Ursprungsort
Shenzhen, China
Kupferne Stärke
0.5oz ~ 5oz
Min. Loch-Größe
0.1mm, 0.25mm
Min. Zeilenabstand
0.075mm, 0.15mm / 0.1mm/4mil
Oberflächenvollenden
OSP, ENIG, HASL
Brett-Größe
OSP, ENIG, HASL
Product
Printed Circuit Board Assembly
Solder mask color
Black, White, Yellow
Solder resist color
Black, White, Red, Green, Blue
Keyword
OEM contract manufacturing PCB
Base Material
FR4 CEM1 CEM3 Hight TG
Product Name
PCB Board Assembly
Components package
01005, 0201 smallest
PCB Standard
IPC-A-610 D/IPC-III Standard