Min. Loch-Durchmesser
0.6MM
Oberflächenvollenden
OSP, HASL,ENIG
Material
FR-4,Aluminum base, copper base,
Size
Custom size, in accordance with gerber file
Testing Service
AOI test, E-test
Board thickness
1.0mm, 1.2mm, 1.5mm,2.0mm
copper thickness
18um, 25um, 35um, 70um
Application
Electronics Device
Number of Layers
1-8 layers
Solder mask color
white, green, black, red, yellow, blue, pink,etc
Silkprinting color
black, white,green, red, yellow, blue, pink,etc
thermal conductiveness
1.0w 1.5W,2.0w