Ursprungsort
Guangdong, China
Hauptsächlichrohstoff
Epoxid
Verbrauch
aufbauen, Verpackung, PCB board
Andere Namen
DeepMaterial Component Encapsulation Adhesive
Klassifikation
Andere Klebstoffe
Art
DeepMaterial Component Encapsulation Adhesive
Product name
DeepMaterial Component Encapsulation Adhesive
Material
One-component potting materials
Storage temperature
-20-8℃
Color
Light yellow to amber
Use
for PCB board sensitive plug-in packaging
Product Description
Component encapsulation adhesive
Curing system
excellent viscosity stability
Feature
thermal cycle to 125℃
Glue type
Epoxy resin-based