Ursprungsort
Guangdong, China
Kupferne Stärke
0.4-2mil(10-50um)
Min. Loch-Größe
0.1mm(4mil)for HDI / 0.15mm(6mil)
Min. Linie Breite
0.075mm/0.075mm(3mil/3mil)
Min. Zeilenabstand
0.003''
Oberflächenvollenden
HASL/OSP/Ag/ENIG/ENEPIG/Immersion silver,Tin
PCB Test
Flying probe and AOI (Default)/Fixture Test
Electrical Testing
Net List Test, Flying Probe Test, Through Hole Test, Dual Access Test
Certificate Standard
IPC-A-600H Class 2, Class 3, TS16949,ROHS and as your need
Special requirements
Buried and blind vias, Impedance control, via plug, BGA soldering etc.
Copper Thickness
1/3oz ~6oz
Base Material
FR-4,Hi-TG FR4,CEM-1,CEM-3
Surface Finishing
HASL(LF), Immersion gold