Ursprungsort
Guangdong, China
Kupferne Stärke
1/2OZ 1OZ 2OZ 3OZ
Min. Linie Breite
0.10mm(4mil)
Min. Zeilenabstand
0.10mm(4mil)
Oberflächenvollenden
HASL,OSP,Immersion Gold/Silver,ENIG
Board Thickness
0.1-4mm±10%
Base Material
FR4, High TG FR4, High Frequency, Alum, FPC
Solder mask color
Green,white,black,blue,red...
Min line/space
0.075/0.075mm
Drilling size
Min 0.0078"(0.2mm)
Others
AOI, X-ray, Programming, testing, packing, plastic,metal, coating
Item
mi power bank circuit board supply