Ursprungsort
Guangdong, China
Material
C7025 H-High Conductivity Copper
Plating specification
Tinning of contact points
Current Rating
16A Max AC/DC
Contact Resistance
≤20MΩ Max
Plating Code
Y2-40~120u"(1~3um)TIN
Pressure connection diameter
0.2-0.35/0.5-0.75/1.0-1.50
Temperture Range
-40℃ to +125℃
OD
1.1-1.75/1.4-1.9/1.9-2.4
Four guidelines
Brass/nickel/gold plated surface