Modellnummer
Custom PCB & PCB Assembly
Ursprungsort
Guangdong, China
Kupferne Stärke
0.4-2mil(10-50um)
Min. Loch-Größe
0.1mm(4mil)for HDI / 0.15mm(6mil)
Min. Linie Breite
0.075mm/0.075mm(3mil/3mil)
Min. Zeilenabstand
0.003''
Oberflächenvollenden
HASL/OSP/Ag/ENIG/ENEPIG/Immersion silver/Tin
Application Area
Automotive, Medical, Industry, IOT, Smart Home, security equipment,
Capacity
70 million placements per month
Max board size
457 * 356(18'' * 14'')
Speed
0.15sec/chip,0.7sec/QFR
Quality Assurance
AOI IQC PQC QA