Ursprungsort
Guangdong, China
Kupferne Stärke
0.4-2mil(10-50um)
Min. Loch-Größe
0.1mm(4mil)for HDI / 0.15mm(6mil)
Min. Linie Breite
0.075mm/0.075mm(3mil/3mil)
Min. Zeilenabstand
0.003''
Oberflächenvollenden
HASL/OSP/Ag/ENIG/ENEPIG/Immersion silver,Tin
Base Material
FR4, CEM3, PTFE, Aluminum etc
Surface Finishing
HASL, OSP, Immersion Gold/Tin/Silver etc
Hole Tolerance
PTH: ±0.075, NTPH: ±0.05
Solder Mask
Green/black/blue/white/red
Finished Thickness Tolerance
±5%
Profiling Punching
Routing, V-CUT, Beveling