Kupferne Stärke
0.5-4OZ / 1 Oz / 2Oz or Custom
Min. Loch-Größe
T/2mm / 0.2 Mm / 0.15mm or Custom
Min. Linie Breite
0.15mm / 0.1mm or Custom
Min. Zeilenabstand
0.15mm / 0.1mm/4mil or Custom
Oberflächenvollenden
HASL,Immersion gold,Flash gold, plated silver, OSP
Application
Electronics Device
Solder mask color
Green, yellow, blue, black, red
Min solder mask bridge
0.08mm
Base Material
FR4, Rogers, Taconic, Nalco, Isola
PCBA Test Technology
AOI, X-Ray, flying probe, visual inspection