Kupferne Stärke
0.5-4OZ / 1 Oz / 2Oz or Custom
Min. Loch-Größe
T/2mm / 0.2 Mm / 0.15mm or Custom
Min. Linie Breite
0.15mm / 0.1mm or Custom
Min. Zeilenabstand
0.15mm / 0.1mm/4mil or Custom
Oberflächenvollenden
HASL,Immersion gold,Flash gold, plated silver, OSP
Application
Electronics Device
Board Thickness
1.6mm-3.2mm
Certificate
ISO/TS16949/RoHS/TS16949