Kupferne Stärke
1/2 Oz Min
Min. Loch-Größe
0.2mm/0.3mm
Min. Zeilenabstand
0.076mm
Oberflächenvollenden
Immersion Gold
Type
Customize Flexible Circuit Board
Assembly Service
COB Component Assembly
PCB Standard
IPC-II Standard
Testing Service
AOI/ X-Ray/ Function Test/ Solder Paste Testing
Outline Profile
Drilled/ Punching/ Laser Cut
Surface Finishing
HASL\OSP\immersion Gold/ Lead Free HASL
Solder Mask
Brown Coverlay+green Solder Mask